Home> Products> Ceramic Substrate> Metallized Ceramic Substrate> Direct Bond Copper DBC Ceramic Substrate for PCB

Direct Bond Copper DBC Ceramic Substrate for PCB

Direct Bond Copper DBC Ceramic Substrate for PCB
Direct Bond Copper DBC Ceramic Substrate for PCB
Direct Bond Copper DBC Ceramic Substrate for PCB
  • Payment Type: T/T,Paypal,Western Union
  • Incoterm: FOB,CFR,CIF,EXW,FCA,CPT,CIP
  • Min. Order: 100 Set/Sets
  • Transportation: Ocean,Land,Air
  • Port: Shenzhen Port,Hongkong Port
Price:
  • $5

    ≥100 Set/Sets

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Product Detail Description
Product Attributes

Model No.Customized

BrandJinghui ceramics

ColorWhite

Max. Overall Length100mm

ToleranceBest To Be 0.01mm

Max. OD100mm

Min. Wall Thickness0.3mm

Precision ProcessFine Grinding,maching,laser Cutting

CertificateISO9001:2008, SGS

FeaturesExcellent Insulation, Heat Dissipation

ApplicationCeramic Circuit Board

Material95% Alumina, AlN Ceramics

Packaging & Delivery
Selling Units: Set/Sets
Package Type: Export carton
Supply Ability & Additional Information

PackagingExport carton

Productivity100,000 sets/month

TransportationOcean,Land,Air

Place of OriginChina

Supply Ability500,000 sets/month

CertificateRoHS

PortShenzhen Port,Hongkong Port

Payment TypeT/T,Paypal,Western Union

IncotermFOB,CFR,CIF,EXW,FCA,CPT,CIP

Product Description
Direct Bond Copper DBC Ceramic Substrate for PCB Given the properities of good heat transfer properties, vacuum tightness and minimum electric resistance, alumina Metallized Ceramics are an ideal components for high vacuum ,high voltage and high pressure applications. By applying a thin metallic coating(general Mo/Mn), by then following covered with plating, like Nickel/Copper/Gold...to the surface of the ceramic,, the welding between ceramic and metal can be achieved, which is also known...
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Home> Products> Ceramic Substrate> Metallized Ceramic Substrate> Direct Bond Copper DBC Ceramic Substrate for PCB

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