Products> Ceramic Substrate> Metallized Ceramic Substrate> Direct Bonded Copper DBC Metallization of Alumina Substrate
Direct Bonded Copper DBC Metallization of Alumina Substrate
Direct Bonded Copper DBC Metallization of Alumina Substrate
Direct Bonded Copper DBC Metallization of Alumina Substrate
Direct Bonded Copper DBC Metallization of Alumina Substrate
Direct Bonded Copper DBC Metallization of Alumina Substrate
Direct Bonded Copper DBC Metallization of Alumina Substrate
Direct Bonded Copper DBC Metallization of Alumina Substrate
Direct Bonded Copper DBC Metallization of Alumina Substrate

Direct Bonded Copper DBC Metallization of Alumina Substrate

  • $1

    ≥1 Piece/Pieces

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  • Payment Type: T/T,Paypal,Credit Card
  • Incoterm: FOB,CIF,EXW,FCA,DDP,Express Delivery
  • Min. Order: 1 Piece/Pieces
  • Transportation: Ocean,Land,Air,Express
  • Port: Shenzhen
Supply Ability & Additional Information
Additional Information

PackagingVacuum Packaging

TransportationOcean,Land,Air,Express

Place of OriginChina

CertificateRoHS, REACH, ISO9001

HS Code8547100000

PortShenzhen

Payment TypeT/T,Paypal,Credit Card

IncotermFOB,CIF,EXW,FCA,DDP,Express Delivery

Product Attributes

Model No.Customized

BrandJinghui Ceramic

Place Of OriginChina

SpeciesCeramic Plates

ApplicationIndustrial Ceramic

Finished ProductCeramic Circuit Board

Substrate Material96%, 99.6% Alumina

Surface Metallization ProcessDirect Bonded Copper (DBC / DCB) Technology

Packaging & Delivery
Selling Units: Piece/Pieces
Package Type: Vacuum Packaging
Product Description
Direct Bonded Copper DBC Metallization of Alumina Substrate Introduction of Direct Bonded Copper Technology Direct Bonded Copper (DBC) technology is a Ceramic metallization method of bonding copper foil on the ceramic surface. The basic principle is to introduce oxygen element between Cu and ceramic, form Cu/O eutectic liquid phase at 1065-1083°C, and then react with Ceramic Substrate and copper foil to form CuAlO2 or Cu(AlO2)2, and realize the bonding between copper foil and...
Company Profile

Established in 2008, Jinghui Industry Ltd. has been committed to the design, development and manufacture of industrial ceramics, specialized in manufacturing and exporting ceramic products, such as zirconia ceramic parts, alumina ceramic parts, silicon nitride ceramic parts, aluminum nitride ceramic parts, etc.

Our facility is located in Loudi city, Hunan Province, China, and the export division is set up in Shenzhen city, with convenient transportation access. Our products have already qualified by ISO9001, RoHS, REACH and FDA. Because of stable performance and high precision, our products have been successfully used in various areas, including electronic, mechanical, aerospace, textile, chemical fileds, as well as scientific researches.

We have over 10 production lines, covering raw material preparation, shaping, sintering, secondary CNC machining and metallizing. The export business takes around 70% of the company′s annual turnover. Our well-equipped facilities and excellent quality control system throughout all stages of production enable us to guarantee total customer satisfaction.

We promise we will spare no efforts to serve our clients with high-quality products. Welcome clients around the world to contact us.

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Products> Ceramic Substrate> Metallized Ceramic Substrate> Direct Bonded Copper DBC Metallization of Alumina Substrate

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