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Metallized Ceramic Substrate

Metallized Ceramic Substrates, also known as ceramic circuit boards, are obtained by metallizing the surface of the Bare Ceramic Substrate through technical means. According to different preparation principles and Ceramic metallization processes, metallized ceramic substrates can be divided into two categories.


1. Planar Ceramic Substrate:

- TFC: thin film Ceramic Substrate

- TPC: Thick Printing Ceramic Substrate

- DBC: Direct Bonded Copper Ceramic Substrate

- DPC: Direct Plated Copper Ceramic Substrate

- AMB: Active Metal Brazing Ceramic Substrate

- LAM: Laser Activation Metallization Ceramic Substrate


2. Three-dimensional Ceramic Substrate

- HTCC: High Temperature Co-fired Ceramic Substrate

- LTCC: Low Temperature Co-fired Ceramic Substrate

- MSC: Multilayer Sintered Ceramic Substrate

- DAC: Direct Adhesion Ceramic Substrate

- MPC: Multilayer Plating Ceramic Substrate

- DMC: Direct Molding Ceramic Substrate


The following table is a comparison of several common metallized ceramic substrates.


Comparison of Surface Metallization Process_06


For heat dissipation of high-power semiconductor devices, we usually choose metal substrates or ceramic substrates. As an emerging heat dissipation material, ceramic substrates have better thermal conductivity and insulation than metal substrates and are more suitable for power electronic product packaging. They have become basic materials for the structural technology and interconnection technology of high-power electronic circuits, widely used in LED, automotive electronics, aerospace and military electronic components, laser and other industrial electronic fields.

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    Electrical Ceramic DBC Substrate For Power Electronics Jinghui Ceramic has well-equipped electronic ceramic production equipment and testing instruments. We use the tape casting method to produce ceramic substrates. Our leading product is alumina...
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    DBC Metallized Ceramic Substrate With Gold Plating The description of DBC ceramic substrate: 1.Material: 96% alumina, aluminum oxide 2.Base layer:99.99% copper plating 3. Thickness of cooper plate: from 10 to 600 micrometers (µm) 4. Type of top...
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    Direct Bond Copper DBC Ceramic Substrate for PCB Given the properities of good heat transfer properties, vacuum tightness and minimum electric resistance, alumina metallized ceramics are an ideal components for high vacuum ,high voltage and high...
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    DBC Ceramic Substrates for Electronics Performance Advantages of DBC Ceramic Substrates Direct Bonded Copper (DBC) technology is mainly a ceramic surface metallization technology developed based on alumina ceramic substrates. DBC ceramic substrate...
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    Metallized AlN Aluminum Nitride Ceramic CoB Substrate Why Choose Aluminum Nitride Ceramic Substrate Currently, the LED industry on the market mainly uses metal-based printed circuit boards (MCPCB). As the demand for high-power LEDs progresses, the...
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    Gold Plated Ceramic Substrate Ceramic metallized IGBT circuit boards are based on thick film circuit technology and deposit functional metal layers through ceramic surface metallization manufacturing processes. The product has outstanding advantages...
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    Electrical Metallized Ceramic Substrate with Silver Plating The base ceramic substrate is made of high purity alumina oxide, then a metallic layer will be applied on the designated area, such as silver coating, nickle coating or gold coating. The...
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    It's made of alumina oxide, or nitride aluminum. Alumina ceramic substrate is always to be used as printed circuit board (PCB), like DBC substrate, Silver coating substrate, Nickle coating substrate and so on. Metallized substrates in different...
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    Mo-Mn Metallization High Purity Alumina Metallized Ceramic Substrate Product Introduction Ceramic substrate metallization is to firmly adhere a layer of metal film on the surface of ceramic substrate to realize the welding between ceramic and metal....
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    High-melting point Metal / Mo-Mn Method Alumina PCB Product Introduction With the development of third-generation semiconductor (including GaN, SiC, AlN, etc.) technology, power devices have begun to develop rapidly in the fields of semiconductor...
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    Direct Plated Copper DPC Metallized Al2O3 Alumina Substrate Introduction of Direct Plated Copper (DPC) Technology Direct Plated Copper (DPC) technology is a ceramic circuit processing technology developed on the basis of ceramic thin film...
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    High Thermal Conductivity DBC AlN Ceramic Substrate The DBC substrate is a metalized substrate in which copper plating is bonded to alumina or aluminum nitride ceramic substrate directly under high temperature sintering to form a film. They are...
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