Home> Products> Ceramic Substrate> Metallized Ceramic Substrate> DBC Ceramic Substrates for Electronics

DBC Ceramic Substrates for Electronics

DBC Ceramic Substrates for Electronics
  • Payment Type: T/T,Paypal,Western Union,Western Union
  • Incoterm: FOB,CIF,EXW,FCA,DDU
  • Min. Order: 100 Piece/Pieces
  • Transportation: Ocean,Land,Air,Express
  • Port: Shenzhen
Price:
  • $1-100 /Piece/Pieces

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Product Detail Description
Product Attributes

Model No.Customized

BrandJinghui Ceramic

Place Of OriginChina

SpeciesCeramic Plates

MaterialAlumina Ceramic

ColorWhite

Max. Overall Length100mm

ToleranceBest To Be 0.01mm

Max. OD100mm

Min. Wall Thickness0.3mm

Precision ProcessFine Grinding,maching,laser Cutting

FeaturesExcellent Insulation, Heat Dissipation

ApplicationCeramic Circuit Board

Packaging & Delivery
Selling Units: Piece/Pieces
Package Type: Export carton
Supply Ability & Additional Information

PackagingExport carton

Productivity500,000 Pieces/month

TransportationOcean,Land,Air,Express

Place of OriginChina

Supply Ability500,000 Pieces/month

CertificateRoHS, REACH, ISO9001

HS Code8547100000

PortShenzhen

Payment TypeT/T,Paypal,Western Union,Western Union

IncotermFOB,CIF,EXW,FCA,DDU

Product Description
DBC Ceramic Substrates for Electronics Performance Advantages of DBC Ceramic Substrates Direct Bonded Copper (DBC) technology is mainly a ceramic surface metallization technology developed based on Alumina ceramic substrates. DBC Ceramic Substrate has the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength and low expansion of ceramics, as well as the high electrical conductivity and excellent welding performance of oxygen-free copper, and...
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Home> Products> Ceramic Substrate> Metallized Ceramic Substrate> DBC Ceramic Substrates for Electronics

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