Home> Direct Bonded Copper

Direct Bonded Copper

- manufacturer, factory, supplier from China (Total 7 Products for Direct Bonded Copper)
Brand: Jinghui Ceramic
Min. Order: 1 Piece/Pieces
Model No: Customized
Transportation: Ocean,Land,Air,Express
Packaging: Vacuum Packaging
Place of Origin: China
USD 1
Electrical Ceramic DBC Substrate For Power Electronics Jinghui Ceramic has well-equipped electronic ceramic production equipment and testing instruments. We use the tape casting method to produce ceramic substrates. Our leading product is alumina...
Brand: Jinghui Ceramic
Min. Order: 1 Piece/Pieces
Model No: Customized
Transportation: Ocean,Land,Air,Express
Packaging: Vacuum Packaging
Place of Origin: China
USD 1
Direct Bonded Copper DBC Metallization of Alumina Substrate Introduction of Direct Bonded Copper Technology Direct Bonded Copper (DBC) technology is a ceramic metallization method of bonding copper foil on the ceramic surface. The basic principle is...
Brand: Jinghui ceramics
Min. Order: 100 Piece/Pieces
Model No: Customized
Transportation: Ocean,Land,Air,Express
Packaging: Vacuum Packaging
Place of Origin: China
USD 1 ~ 100
High Thermal Conductivity DBC AlN Ceramic Substrate The DBC substrate is a metalized substrate in which copper plating is bonded to alumina or aluminum nitride ceramic substrate directly under high temperature sintering to form a film. They are...
Brand: Jinghui ceramics
Min. Order: 100 Piece/Pieces
Model No: Customized
Transportation: Ocean,Land,Air,Express
Packaging: Vacuum Packaging
Place of Origin: China
USD 1 ~ 100
High Mechanical Strength IGBT AlN Ceramic Substrate The Prime Advantages of DBC Substrates 1. Thermal conductivity: 24~180 W/m.k (20~200 times of aluminum-based copper-clad substrate), dielectric withstand voltage 20 KV/mm (17 times of other circuit...
Direct Plated Copper DPC Metallized Al2O3 Alumina Substrate
Brand: Jinghui ceramics
Min. Order: 100 Piece/Pieces
Model No: Customized
Transportation: Ocean,Land,Air,Express
Packaging: Vacuum Packaging
Place of Origin: China
USD 1 ~ 100
Direct Plated Copper DPC Metallized Al2O3 Alumina Substrate Introduction of Direct Plated Copper (DPC) Technology Direct Plated Copper (DPC) technology is a ceramic circuit processing technology developed on the basis of ceramic thin film...
Brand: Jinghui ceramics
Min. Order: 100 Set/Sets
Model No: Customized
Transportation: Ocean,Land,Air
Packaging: Export carton
Supply Ability: 500,000 sets/month
Place of Origin: China
Productivity: 100,000 sets/month
Direct Bond Copper DBC Ceramic Substrate for PCB Given the properities of good heat transfer properties, vacuum tightness and minimum electric resistance, alumina metallized ceramics are an ideal components for high vacuum ,high voltage and high...
Brand: Jinghui ceramics
Min. Order: 100 Piece/Pieces
Model No: Customized
Transportation: Ocean,Land,Air,Express
Packaging: Vacuum Packaging
Place of Origin: China
USD 1 ~ 100
DCB / DBC Ceramic Substrate Direct Copper Bonding Principle of Direct Bonded Copper DBC Ceramic Substrate Oxygen is added between copper and ceramic to obtain a Cu-O eutectic liquid at a temperature of 1065-1083°C, and then react to obtain an...
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Review
  • “Very fast delivery service and the Direct Bonded Copper was as described.”
    Ayu Syafiqah Muhamad
    "ИНКОМ - ТУР" ОБЩЕСТВО С ОГРАНИЧЕННОЙ ОТВЕТСТВЕННОСТЬЮ
  • “all good thank you”
    Ing.maglio Cesar Muñoz
    1ST IMPRESSIONS SIGNS
  • “batter than i bought at another supplier last time.So glad to meet Jinghui Ceramics company.”
    Ron Leung
    Modern Sprinkler Corporatio
  • “Speaking of this cooperation with the Chinese manufacturer, I just want to say"well dodne", we are very satisfied.I will come back to buy Direct Bonded Copper again.”
    Nina Booth
    1ST CHOICE SPEAKERS (UK)
  • “Thank you very much. good saler.”
    Joe Bennington
    "ЦИФРОВОЙ ОКТЯБРЬ" ОБЩЕСТВО С ОГРАНИЧЕННОЙ ОТВЕТСТВЕННОСТЬЮ
Electrical Ceramic DBC Substrate For Power Electronics
Direct Bonded Copper DBC Metallization of Alumina Substrate
High Thermal Conductivity DBC AlN Ceramic Substrate
Hig Power IGBT Aluminum Nitride Ceramic Substrate
Direct Bond Copper DBC Ceramic Substrate for PCB
DCB / DBC Ceramic Substrate Direct Copper Bonding

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