Products> Ceramic Substrate> Bare Ceramic Substrate> Low Warpage Industrial Alumina Ceramic Substrate
Low Warpage Industrial Alumina Ceramic Substrate
Low Warpage Industrial Alumina Ceramic Substrate
Low Warpage Industrial Alumina Ceramic Substrate
Low Warpage Industrial Alumina Ceramic Substrate
Low Warpage Industrial Alumina Ceramic Substrate
Low Warpage Industrial Alumina Ceramic Substrate
Low Warpage Industrial Alumina Ceramic Substrate
Low Warpage Industrial Alumina Ceramic Substrate

Low Warpage Industrial Alumina Ceramic Substrate

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    • Payment Type: T/T,Paypal
    • Incoterm: FOB,CFR,CIF,FCA,CPT,CIP,DDU,Express Delivery
    • Min. Order: 500 Piece/Pieces
    • Transportation: Ocean,Land,Air,Express
    • Port: Shenzhen Port,Hongkong Port
    Supply Ability & Additional Information
    Additional Information

    PackagingExport carton

    Productivity100,000 pieces/month

    TransportationOcean,Land,Air,Express

    Place of OriginChina

    Supply Ability500,000 sets/month

    CertificateRoHS

    HS Code8547100000

    PortShenzhen Port,Hongkong Port

    Payment TypeT/T,Paypal

    IncotermFOB,CFR,CIF,FCA,CPT,CIP,DDU,Express Delivery

    Product Attributes

    Model No.Customized

    BrandJinghui ceramics

    Place Of OriginChina

    SpeciesCeramic Plates

    ApplicationStructure Ceramic

    MaterialAlumina Ceramic

    Processing ServiceMoulding, Cutting, Punching

    ToleranceBest To Be 0.01mm

    FeaturesExcellent Insulation, Heat Dissipation

    Precision ProcessFine Grinding,maching,laser Cutting

    Material95%, 99% Or 99.5% Alumina

    ColorWhite, Pink, Balck, Ivory

    CertificateISO9001:2015, RoHS, REACH

    ApplicationCeramic Liner Plate, Ceramic Circuit Board

    Max. Overall Length500 Mm

    Min. Wall Thickness0.10Mm

    Packaging & Delivery
    Selling Units: Piece/Pieces
    Package Type: Export carton
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    Product Description
    Low Warpage Industrial Alumina Ceramic Substrate Ceramic Substrates are extensively used in a variety of high-power electrical and electronic modules as the heat-sink, insulator and holder components. In order to reach the bonding strength requirement of metal plating on designated surface of Ceramic Substrate, ideal heat dissipation, a very good flatness and low warpage of the ceramic substrate is must. The main way to enhance the parameter is by find lapping the surface. The finest...
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    Products> Ceramic Substrate> Bare Ceramic Substrate> Low Warpage Industrial Alumina Ceramic Substrate

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