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What are main ceramic metallization methods for ceramic substrates?
With the continuous increasing power of semiconductor chips.the development trend of light weight and high integration 5th generation wireless systems, in order to make the device run more smoothly...
With the increasing power of semiconductor chips, the development trend of light weight and high integration is becoming more and more obvious, and the importance of heat dissipation has been...
As the microstructure of the surface of advanced ceramic materials is different from the metal materials, brazing often does not happen from ceramic to metal to bond them directly. Therefore, the...
The main difference between fine ceramics and traditional ceramics
1. In the raw materials, it breaks through the boundary of traditional ceramics with clay as the main raw material. Special ceramics generally use oxides, nitrides, silicides, borides and carbides as...
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