Metallized Ceramic Substrate

Metallized Ceramic Substrates, also known as ceramic circuit boards, are obtained by metallizing the surface of the Bare Ceramic Substrate through technical means. According to different preparation principles and Ceramic metallization processes, metallized ceramic substrates can be divided into two categories.

1. Planar Ceramic Substrate:

- TFC: thin film Ceramic Substrate

- TPC: Thick Printing Ceramic Substrate

- DBC: Direct Bonded Copper Ceramic Substrate

- DPC: Direct Plated Copper Ceramic Substrate

- AMB: Active Metal Brazing Ceramic Substrate

- LAM: Laser Activation Metallization Ceramic Substrate

2. Three-dimensional Ceramic Substrate

- HTCC: High Temperature Co-fired Ceramic Substrate

- LTCC: Low Temperature Co-fired Ceramic Substrate

- MSC: Multilayer Sintered Ceramic Substrate

- DAC: Direct Adhesion Ceramic Substrate

- MPC: Multilayer Plating Ceramic Substrate

- DMC: Direct Molding Ceramic Substrate

The following table is a comparison of several common metallized ceramic substrates.

For heat dissipation of high-power semiconductor devices, we usually choose metal substrates or ceramic substrates. As an emerging heat dissipation material, ceramic substrates have better thermal conductivity and insulation than metal substrates and are more suitable for power electronic product packaging. They have become basic materials for the structural technology and interconnection technology of high-power electronic circuits, widely used in LED, automotive electronics, aerospace and military electronic components, laser and other industrial electronic fields.