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Heat Dissipation Aluminum Nitride Ceramic Substrate

Heat Dissipation Aluminum Nitride Ceramic Substrate
Heat Dissipation Aluminum Nitride Ceramic Substrate
Heat Dissipation Aluminum Nitride Ceramic Substrate
Heat Dissipation Aluminum Nitride Ceramic Substrate
  • Payment Type: T/T,Paypal
  • Incoterm: FOB,CFR,CIF,EXW,FCA,CPT,CIP
  • Min. Order: 10 Piece/Pieces
  • Transportation: Air,Express
  • Port: Shenzhen,HongKong
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Product Detail Description
Product Attributes

Model No.Standard or custom-made

BrandJinghui ceramics

Place Of OriginChina

SpeciesCeramic Plates

ApplicationIndustrial Ceramic

Processing ServiceMoulding

ColorGray

Min. Wall Thickness0.30mm

MaterialAluminum Nitride

Max. Size400mm

FeaturesHigh Thermal Conductivity

DensityHigher Than 3.3g/cm3

Precision ProcessLapping, Machining

ApplicationHeat-sinks for Semiconductor Devices

Packaging & Delivery
Selling Units: Piece/Pieces
Package Type: Export carton
Picture Example:
Supply Ability & Additional Information

PackagingExport carton

Productivity100000 pieces/Month

TransportationAir,Express

Place of OriginChina

Supply Ability50000 pieces/month

CertificateRoHS,REACH

HS Code8547100000

PortShenzhen,HongKong

Payment TypeT/T,Paypal

IncotermFOB,CFR,CIF,EXW,FCA,CPT,CIP

Product Description
Heat Dissipation Aluminum Nitride Ceramic Substrate The specification 1. We are supplying with many round, square and rectangular aluminum nitride ceramic substrate 2. The typical thickness of wafer/substrate covers 0.38mm, 0.5mm, 0.635mm, 1.0mm, 1.2mm 3. The biggest diameter of round Ceramic Wafer can be up to 400mm in 3mm, 4mm, 5mm thick 4. The max. side-length of square and rectangular ceramic base can be 400mm by 500mm 5. Surface treatment: it can be one-side, or double side...
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Home> Products> Ceramic Substrate> Bare Ceramic Substrate> Heat Dissipation Aluminum Nitride Ceramic Substrate

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