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High Thermal Conductivity Aluminum Nitride Ceramic Wafer

High Thermal Conductivity Aluminum Nitride Ceramic Wafer

Payment Type: T/T,Paypal
Incoterm: FOB,CFR,CIF,EXW,FCA,CPT,CIP
Min. Order: 1 Piece/Pieces
Transportation: Ocean,Land,Air
Port: Shenzhen,HongKong

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Product Detail Description

Product Attributes

Model No.: Customized

Brand: Jinghui ceramics

Color: Gray

Precision Process: Fine Grinding, Machining

Application: Ceramic Waser, Ceramic Disc, Heat-sink Plate

Min. Wall Thickness: 0.30mm

Material: Aluminum Nitride

Max. Size: 400mm

Features: High Thermal Conductivity

Density: Higher Than 3.3g/cm3

Packaging & Delivery

Selling Units:	Piece/Pieces
Package Type:	Export carton

Supply Ability & Additional Information

Packaging: Export carton

Productivity: 100000 pieces/month

Transportation: Ocean,Land,Air

Place of Origin: China

Supply Ability: 50000 pieces/month

Certificate: RoHS

HS Code: 8547100000

Port: Shenzhen,HongKong

Payment Type: T/T,Paypal

Incoterm: FOB,CFR,CIF,EXW,FCA,CPT,CIP

Product Description

high thermal conductivity Aluminum Nitride Ceramic Wafer The specification of the AlN Ceramic Substrate 1. We are supplying with many round ceramic wafer, square & rectangular ceramic substrate 2. The typical thickness of wafer covers 0.38mm, 0.5mm, 0.635mm, 1.0mm, 1.2mm, 1.5mm 3. The biggest diameter of round ceramic wafer can be up to 400mm in 3mm, 4mm, 5mm thick 4. The max. side-length of square and rectangular ceramic wafer can be 400mm by 500mm 5. Surface treatment: it can be...

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