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Jinghui Industry Ltd.

Industrial Heat Dissipation Custom AlN Ceramic Wafer
Industrial Heat Dissipation Custom AlN Ceramic Wafer
Industrial Heat Dissipation Custom AlN Ceramic Wafer
Industrial Heat Dissipation Custom AlN Ceramic Wafer

Industrial Heat Dissipation Custom AlN Ceramic Wafer

Payment Type: T/T,Paypal,Money Gram,Western Union
Min. Order: 1 Piece/Pieces
Delivery Time: 35 Days

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Basic Info

    Model No.: Customized

    Precision Process: Fine Grinding, Machining

    Application: Ceramic Waser, Ceramic Disc, Heat-sink Plate

    Material: Aluminum Nitride

    Color: Gray

    Max. Size: 400mm

    Min. Wall Thickness: 0.30mm

    Features: High Thermal Conductivity

    Density: Higher Than 3.3g/cm3

Additional Info

    Packaging: Export carton

    Productivity: 100000 pieces/month

    Brand: Jinghui ceramics

    Transportation: Ocean,Land,Air

    Place of Origin: China

    Supply Ability: 50000 pieces/month

    Certificate: RoHS

    HS Code: 8547100000

    Port: Shenzhen,HongKong

Product Description

Industrial Heat Dissipation Custom AlN Ceramic Wafer

The description of the AlN ceramic wafers

The aln ceramic wafer which has high thermal conductivity of more than 170W/m. K, high resistivity, low dielectric loss, good insulation and some other excellent properties. The ALN wafer is the best choice for a wide range of industrial insulating heat sink material of high power machinery and equipments such as high-frequency equipment substrate, high power transistor module substrate, high-density hybrid circuits, microwave power devices, power semiconductor devices, power electronic devices, optoelectronic components, laser-semi-conductor, LED, IC products, and so on.
AlN substrate can be the best solution in electronics applications where strict conditions are required, such as power modules (MOSFET, IGBT), LED packages for cooling and protecting circuits, packages and modules.

The specification of the AlN ceramic wafers
1. We are supplying with various round ceramic wafer, square & rectangular Ceramic Substrate
2. The typical thickness of wafers covers 0.38mm, 0.5mm, 0.635mm, 1.0mm, 1.2mm, 1.5mm
3. The biggest diameter of round ceramic wafer can be up to 400mm in 3mm, 4mm, 5mm thick
4. The max. side-length of square and rectangular ceramic wafer can be 400mm by 500mm
5. Surface treatment: it can be one-side, or double side polished, metalizing or sand blasting

The main features of the AlN ceramic wafers
1. High thermal conductivity (170 ~220) W/m.k, it's 5~8.5 times higher than that of alumina
2. Similar coefficient of thermal expansion to that of silicon (Si), it helps to achieve high reliability of Si chip
3. High insulation resistance and voltage resistance strength, but low dielectric constant and dielectric loss
4. High mechanical strength, it's up to 450MPa and very dense ceramic body free of porosity
5. It offers very high purity up to 99%, also it's free of toxicity and meet RoHS, REACH regulation

The application of the AlN ceramic wafers
AlN wafer and substrate is an excellent electronic package material, AlN substrate for a wide range of applications,
including thin film and thick film microelectronic , high power and high frequency circuit RF / microwave components and capacitor or resistor

Related products of AlN ceramic wafers

AlN Ceramic wafer Tape casting alumina ceramic substrate Si3N4 Ceramic Substrate


We supply a broad range of ceramic wafers, including Alumina Ceramic wafer, zirconia ceramic wafer,

silicon nitride ceramic wafer, aluminum nitride ceramic wafer and so on.

Property Datasheet of AlN Ceramic Wafers and Ceramic Substrates

% ≥99
Volume Density
% 0
Compressive Strength
MPa -
Bending Strength
MPa 450
Elastic Modulus
MPa 330
Fracture toughness
Mpam1/2 3
Max. service temperature (Non-loading)

Thermal Conductivity (25℃)
Coefficient of Thermal Expansion (CTE)
1*10-6 m/k
Specific heat
1 x 103J/(kg·K)
Volume Resistivity (25℃)
Insulation Breakdown
Dielectric constant (1Mhz)

Production capability and our strength for ceramic wafers

1. Vacuum Hot Pressed Sintering Furnace

Vacuum Hot Press Sintering

2. High Precision Machining Capability

High Precision Machining

3. CNC machining Workshop

CNC Machining

4. Customized capability from small to big size

Customized Production Capability


We have own in-house comprehensive types of manufacturing equipment, including high-pressure forming machines,

vacuum sintering furnace,High precision machining equipment, polishing machines, metalizing production lines.

Inspection and Quality-control Capability for ceramic wafers

1. High Precision Inspection Tools

High Precision InspectionInspection Equipment

2. OQC Inspection Workshop



1. We have complete quality-control system, including IQC, IPQC, QA and OQC

2. We also have professional quality assurance team and precision inspection equipments.

FAQs (Frequently Asked Questions)

Q1:Is it available to provide customized products?

A: We always support custom-made demand as per different dimensions, design and surface treatment.

Q2. When can I get the price?

A: We regularly quote within 24 hours after we get your inquiry. If you are in urgent need of get the price,

please call us or tell us in your email so that we will proceed your inquiry as priority.

Q3. How long can I expect to get the sample?

A: After you pay the sample charge and send us the confirmed files, the samples will be ready for delivery in 4 weeks.

Q4:How long does the whole procedure being worked out?

A: After you place an order, the manufacturing time is about 25 working days.

Q5. Are you a factory or trading company?

A: We are a professional manufacturer. You are welcome to visit our factory.

Looking for ideal AlN Ceramic Wafer Manufacturer & supplier ? We have a wide selection at great prices to help you get creative. All the Inudstrial Ceramic Wafer are quality guaranteed. We are China Origin Factory of Aluminum Nitride Wafer. If you have any question, please feel free to contact us.

Product Categories : Advanced Ceramic Plate > Ceramic Substrate

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