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Home> Products> Ceramic Rods> Zirconia Chip Ceramic Bonding Tool for Semiconductor

Zirconia Chip Ceramic Bonding Tool for Semiconductor

Zirconia Chip Ceramic Bonding Tool for Semiconductor
  • Payment Type: T/T,Paypal,Money Gram,Western Union
  • Incoterm: FOB,CIF,FCA
  • Min. Order: 5000 Piece/Pieces
  • Transportation: Ocean,Land,Air,Express
  • Port: Shenzhen,Hongkong
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    Product Detail Description
    Product Attributes

    Model No.: JH.SC.009

    Brand: Jinghui ceramics

    Place Of Origin: China

    Species: Ceramic Rods

    Application: Industrial Ceramic

    Material: Alumina Ceramic

    Surface Treatment: Polishing

    Precision Process: Fine Grinding

    Material: zirconia

    Color: White

    Typical Tolerance: 0.01mm

    Specification: Min. OD 1mm, Max.50mm Capability

    Features: Superior Mechanical Strength

    Application: Work As Guide Pin

    Packaging & Delivery
    Selling Units: Piece/Pieces
    Package Type: Export carton
    Supply Ability & Additional Information

    Packaging: Export carton

    Productivity: 100,000pcs/month

    Transportation: Ocean,Land,Air,Express

    Place of Origin: China

    Supply Ability: 2,000,000 pieces/month

    Certificate: RoHS

    Port: Shenzhen,Hongkong

    Payment Type: T/T,Paypal,Money Gram,Western Union

    Incoterm: FOB,CIF,FCA

    Product Description
    Zirconia ceramic Chip Bonding tool for Semiconductor Ceramic bonding tools is often made from zirconia ceramic (ZrO2), and characteristic by their ultra-small, high precision injection hole, better surface finish and longer lives. In the early stage, the bonding tools were made out of iron, the biggest weakness of iron is easy to wear out, the quick wear rate will shorten the working life and increase the maintenance times. In addition, iron bonding tools can’t anti-static...
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    Home> Products> Ceramic Rods> Zirconia Chip Ceramic Bonding Tool for Semiconductor
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